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目前有很多工程师在开发高速数字电路板，其中设计热插拔电路以提高电路板功效是一件非常有挑战性的工作。本文将介绍热插拔设计基础，并着重说明不同类型热插拔控制器的利弊，然后详细讲述热插拔三个关键部件的选择过程，即模拟控制器、功率MOSFET和功率感应电阻器，可供中国的设计工程师们参考。

虽然现在已有很多关注于热插拔控制器设计的文献，但是热插拔设计的功能性、可靠性及难易程度还取决于在稳定状态与短路条件下控制器和MOSFET的正确选择。下面我们将对一个电路板设计实例进行逐步分析，并说明应用某些控制器时的设计复杂性。

基本热插拔电路

图1显示了一个基本热插拔电路，它包括一个热插拔控制器(U1)、一个N沟道功率MOSFET(Q1)和一个功率感应电阻器(Rsense)。

有两种类型热插拔控制器，分别是电压控制型和电流控制型。电压控制型对Q1的栅极慢慢充电，漏电压跟随栅极电压变化。这种类型的问题是涌入电流不能直接控制，而取决于输入电源的输出阻抗和热插拔负载的阻抗，可在MOSFET周围加几个分立元件限制涌入电流，因此还必须添加其它一些元件以便在出现故障时实现快速关闭。建议新设计不要采用这种结构，除非是在较低的功率水平上进行热插拔。

电流控制热插拔控制器至少含有一个线性电流放大器(LCA)。电流放大器可以感应Rsense两端的电压，并通过回拉Q1的Vgs以保持Rsense上的电压，从而限制峰值涌入电流。由于涌入电流是可以选择的，所以DC/DC转换器输入电压的上升时间将主要由输入阻抗决定。开机时涌入电流过冲击主要取决于负载阻抗、所选择的MOSFET、热插拔控制器驱动器和热插拔LCA的速度。

选择热插拔控制器

应选择集成的热插拔还是分立的MOSFET/控制器解决方案呢？让我们首先考虑一下采用集成MOSFET的模拟IC方法，可能要考虑的*件事是集成系统IC与单独的控制器和功率MOSFET的比较。对于-48V电信应用，现今市场上至少已有一种集成解决方案，就是来自Supertex的HV111。该器件在模拟过程中集成了一个内置的旁路MOSFET开关，通常而言模拟过程比功率MOSFET具有更高的Rds(on)与面积的乘积，这意味着对于相同的Rds(on)模拟开关将占用更多的空间，或者说在相同的面积内，模拟开关将有更高的Rds(on)，这对80V或100V开关尤其如此。HV111有一个额定80V的开关，典型Rds(on)为1Ω，zui大Rds(on)为1.5Ω。

如果负载电流为1A，则开关zui大电压降为1.5V，可能导致低压锁定，因此制造商将器件的额定值设为1.65A。由于负载为72W，峰值电流可能为2.8A，所以可将器件搜寻范围收窄到外部电流控制器热插拔或分开的功率MOSFET与Rsense。

那么应使用什么样的电流控制器？由于主要关心的是系统可靠性，所以要寻找对过电流或短路响应zui快的控制器，制造商把这个作为从Vsense高电平至拉回到阈值附近的MOSFET的栅极电压或低tpHLsense的传播延时。制造商还可能标出控制回路跨导dIgate/dVsense，它表示栅极电压变化与Vsense电压变化之比。另外还要看一下栅极驱动功能，以确定其可以产生或消除MOSFET寄生电容。

下面我们比较一下故障响应速度和栅极驱动特性。具有较高下拉电流的快速器件在故障条件下功率消耗较低，很多控制器只解决经过控制器的时间延迟，通过MOSFET的开关时间则交由设计人员计算。

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